APTD Industrial Engineer, Scenario Planning

Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are seeking a highly analytical and forward-thinking Engineer, Scenario Planning to support strategic decision-making through data-driven scenario modeling and forecasting.

Key Responsibilities:

• Develop and maintain scenario models to evaluate potential outcomes of strategic initiatives, operational changes, and market shifts.

• Collaborate with cross-functional teams to gather inputs, validate assumptions, and align on key drivers for scenario planning.

• Analyze historical data, trends, and external factors to inform scenario development and sensitivity analysis.

• Present insights and recommendations to stakeholders through clear visualizations and storytelling.

• Support the development of long-range planning frameworks and tools.

• Continuously improve scenario planning methodologies and tools to enhance accuracy and usability.

Required Qualifications:

• Bachelor’s degree in Industrial Engineering, Engineering, Business Analytics, or a related field.

• 3+ years of experience in semiconductor packaging, process integration, or technology development.

• Experience in scenario analysis, resource planning, or capital planning.

• Strong analytical skills with proficiency in Excel and modeling tools

• Work with SAP, ERP systems, and manufacturing execution systems.

• Experience with Data Analytics & Automation tools (Power BI, Tableau, Matlab)

• Proficiency in SQL, Python, or other programming languages for data analysis

• Knowledge of Capital project software (e.g., Power Automate).

• Excellent communication and presentation skills.

• Ability to work independently and collaboratively in a fast-paced environment.