Chief Engineer, Advanced Packaging

Hong Kong Applied Science and Technology Research Institute Company Limited
Hong Kong, HK
On-site

Job Description

Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key force and super‑connector driving innovation and technology advancement in Hong Kong, the Greater Bay Area, and the global innovation ecosystem. This role is strengthened through its merger with Nano and Advanced Materials Institute (NAMI).

Committed to bringing high‑impact research from lab to market, ASTRI advances interdisciplinary, market‑driven R&D that delivers practical innovations for industry and meaningful benefits for society.

Its technological strengths and capabilities enable AI‑powered, cross‑disciplinary ICT and advanced materials solutions across Smart City, Financial Technologies, Digital Health and Life Sciences, New Industrialisation and Intelligent Manufacturing, Application-Specific Integrated Circuits (ASIC) and Advanced Electronics, New Energy and Energy Storage, and Green and ESG Technologies.

Over the years, ASTRI has cultivated a strong pool of I&T talent and earned numerous international awards for its pioneering innovations and contributions to industry and the community. Following the merger with NAMI, ASTRI’s cumulative global patent portfolio has grown to over 1,500, with more than 2,200 technologies successfully transferred to industry.

With enhanced scale and capabilities, ASTRI is uniquely positioned to elevate Hong Kong’s innovation capacity, accelerate technology commercialisation, and drive societal and economic progress through world‑class applied research.

To support our constant endeavour to position Hong Kong as a world-class smart city and an international hub of innovation and technology, we are seeking qualified professionals to fill the following position(s):

Job Req No.: CTO/AECS/HIT/2185

​​​Job Responsibilities:

  • Report to the Vice President, be responsible for understanding the needs of HK & GBA industry and defining corresponding technology & product roadmap in the Semiconductor and New Energy Industries
  • Implement the technology & product roadmap with 5-years project plans and prepare corresponding proposals for both HK & GBA funding applications and industry financial supports
  • Recruit, develop and build a strong team to execute the projects, establish a strong patent and new product portfolios in the Semiconductor and New Energy related applications
  • Promote, market and commercialize the technologies and products to be developed through the projects
  • Initiate, coordinate and consolidate R&D resources from different organizations (e.g., Universities, RIs, etc.) to promote international collaborations and establish the technology leadership and enhance the competitiveness of local industry in the Semiconductor and New Energy fields
  • Perform ad-hoc duties as assigned

Job Requirements:

  • Master's degree or above in the Electronics Packaging, Materials Science & Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines
  • 15+ years’ working experience in the Semiconductor and/or New Energy Industries with well-established expertise in different kinds of semiconductor and new energy technologies and their applications for various electronics products. 10+ years of people management experience with well-developed leadership skills in strategy planning, resource integration, team establishment, plan execution and effective communication
  • In-depth understanding of the technology development trend and the entire semiconductor and/or new energy product development cycle, from package design, materials selection, manufacturing process, system integration, to product qualification is a must
  • Expertise in the electronics materials, power electronics, photovoltaic, energy storage, and wide network & collaboration with universities and companies is a plus
  • Good written and communication skills in English
  • Strong team spirit and interpersonal skills, independent, responsible, aggressive and outgoing character
  • Live ASTRI values

Application:

The appointment will be on renewable contract terms with a competitive salary and performance-linked variable pay. Fringe benefits include paid leave, medical insurance coverage and contribution to MPF. The incumbent will normally work a five-day week.

For interested parties, please submit your application with detailed CV within two weeks of the post date. Applicants are encouraged to submit their applications as soon as possible. The review of applications will continue until post is filled.

The resume should not include any sensitive personal information suc

Skills & Requirements

Technical Skills

Electronics packagingMaterials science & engineeringElectrical engineeringMechanical engineeringPhysicsLeadershipStrategy planningResource integrationTeam establishmentSemiconductorNew energySmart cityFinancial technologiesDigital healthLife sciencesIntelligent manufacturingAsicAdvanced electronicsNew energy and energy storageGreen and esg technologies

Employment Type

FULL TIME

Level

executive

Posted

5/1/2026

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