Copper Electroplating Process Engineer for TGV/TSV/PCB Tech

A leading research institute in Hong Kong is seeking a professional to optimize electroplating copper processes and support developments in electroplating solutions. Candidates should hold a Bachelor's degree in relevant fields with 5-10 years of hands-on experience in the copper process development. This role involves customer interactions on-site and requires strong problem-solving capabilities.

The position offers a renewable contract, a competitive salary, and various fringe benefits including medical coverage.