Engineer, Staff/Manager (Wet Etch / Electroplating)

Qualcomm
Singapore, SG

Job Description

Job Responsibilities

  • Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes
  • Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment
  • Drive excellence in output, quality, cost, equipment uptime, and safety
  • Ensure robust process control, stability, and integration across wet etch and plating operations
  • Lead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actions
  • Drive yield improvement, scrap reduction, and defect reduction through data‑driven analysis
  • Ensure high equipment availability and reliability, particularly for wet benches and plating tools
  • Apply and sustain SPC and statistical analysis tools to monitor and improve process performance
  • Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality issues
  • Work closely with cross‑functional teams including Process Integration, Equipment, Quality, and Manufacturing
  • Provide technical and operational leadership during crisis situations impacting fab operations
  • Ensure strict compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocols

Job Requirements

  • Bachelor’s degree in Engineering, Chemistry, Materials Science, Physics, or related discipline
  • Minimum 10 years of relevant experience in semiconductor wafer fabrication
  • Strong hands‑on technical expertise in Wet Etch, Electroplating, and related wet processes
  • Prior experience in high‑volume semiconductor manufacturing within an MNC environment
  • Strong understanding of:
  • Process integration
  • Statistical Process Control (SPC)
  • Yield improvement and scrap reduction methodologies
  • Equipment maintenance strategies for wet benches and plating tools
  • Proven people management experience, including coaching, talent development, succession planning, and manpower deployment
  • Demonstrated ability to lead root‑cause analysis and corrective action implementation
  • Strong sense of ownership with the ability to work effectively under pressure
  • Hands‑on leadership style with strong problem‑solving and decision‑making capabilities
  • Excellent communication and cross‑functional collaboration skills
  • Familiarity with statistical analysis tools, Excel, PowerPoint, and Word
  • Strong commitment to Environmental Health & Safety (EHS), quality systems, and fab compliance

Skills & Requirements

Technical Skills

Wet etchElectroplatingStatistical process control (spc)Yield improvementScrap reductionEquipment maintenanceProcess integrationStatistical analysisExcelPowerpointWordLeadershipProblem-solvingDecision-makingCommunicationCross-functional collaborationSemiconductor wafer fabrication

Employment Type

FULL TIME

Level

manager

Posted

5/6/2026

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