Plating & Etching Process Engineer for Advanced Packaging

A leading technology firm in Greater London seeks a skilled process engineer to optimize plating and etching processes for semiconductor packaging. Applicants should have a bachelor's degree in a relevant field and at least 3 years of hands-on experience in semiconductor manufacturing. Responsibilities include developing processes for advanced packaging technologies, conducting validations, and liaising with vendors. This role requires strong communication and statistical analysis skills along with proficiency in software tools.

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