Job Summary
We are seeking a highly motivated engineer to join our Technology Development team focused on advanced thin film deposition processes for next-generation memory technologies. This role spans responsibilities from process development to technical leadership, depending on experience level (Principal/Staff).
Key Responsibilities
- Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures
- Design and execute complex DOE experiments to improve process capability, uniformity, and reliability
- Perform in-depth root-cause analysis using advanced modeling and characterization techniques
- Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges
- Drive innovation in film deposition for improved performance, cost efficiency, and sustainability
- Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles
- Define technology roadmaps and lead strategic research initiatives. Generate intellectual property and influence future deposition technology directions
- Mentor junior engineers and lead multi-disciplinary technical projects
Requirements:
Education:
- Ph.D / Master’s in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
Experience:
- Master with minimum 8 years or PhD with minimum 5 years hands-on experience in advanced thin film deposition, characterization or related semiconductor field
Skills:
Core Technical:
- Expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes
- Strong understanding of film growth mechanisms, surface chemistry, and plasma physics
- Knowledge of thermodynamics, chemical kinetics, and reaction engineering
Analytical & Modeling:
- Proficiency in DOE, SPC, and advanced statistical analysis
- Some Familiarity with TCAD or process simulation tools for film modeling
- Data analytics and machine learning for process optimization
Characterization:
- Hands-on experience with TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry, and other thin film metrology
Problem-Solving:
- Advanced root-cause analysis and failure mode identification
- Ability to develop predictive models for process behavior