Process Engineer – Advanced Packaging
Who We Are
Thintronics is solving one of the defining challenges in modern computing: moving massive amounts of data and power between chips at unprecedented speeds and densities. As Moore's Law slows, performance is increasingly defined by advanced packaging, chiplets, and high-density substrates. Our materials technology enables new levels of interconnect density, signal integrity, and power delivery inside next- generation semiconductor packages. We partner directly with leading IDMs, foundries, substrate manufacturers, and OSATs building the most…