Process Engineer (Diffusion / Photo / Thin Film / Etch)

Job Purpose

Sustain and improve process / SPC to meet quality, cost, productivity requirements Job Descriptions:

Requirements

Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.

Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK

Review ESPC charts using SPACE. Know all the rules for ESPC

Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE

Create SPC charts, DCOP and modify SLDB using PROMIS (CAMSTAR)

Upload recipe, check recipe and ensure recipe content compliance using RMS

Raise PCRB and understands the requirements for PCRB opening, follow through with qual plan, analyze data using required software and CR closure

Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN

Setup and troubleshoot issues in recipes/job files in all metrology tools within the Module. Do regular housekeeping of production job files

Follow up on pass down to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required

Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run

Work on reducing process constraints so that Mfg can have more flexibility

Perform process matching between equipment to reduce variation and analysis / DOE to find factors for better tool matching

Participate in CIP programs to optimize process window, cost, yield, and productivity

Work as a team with both Equipment and Mfg Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals

Represent own Module to attend cross-functional task team to address yield improvement / excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs

Follow good housekeeping and safety rules in office and Fab

Provide feedback/training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment

Provide monthly report to Supervisor

Participate in wafer scrap reduction. Ensure no human error

Responsible and accountable for complying with and implementing environmental, health, safety and security (EHSS) system, policies, procedures and guidelines that are applicable to your scope of work, thereby maintaining a healthy and safe workspace Requirements:

Degree in Electrical / Electronics /Microelectronics / Chemical Process Engineering / Chemistry / Physics related major

Diploma holders 3 years working experience in Semiconductor Front-End Process

Perform Normal/ Swing Shift ( or 12-hour rotating shift if required

Good interpersonal skills and is an excellent team player

Good verbal and written communication skill

Logical thinking capability and good analytical skill

High level of integrity with leadership attribute

Highly committed with good ownership and accountability

Passion for the semiconductor / manufacturing industry