The Research Fellow will play a senior technical role in Doctech’s R&D team, leading and executing research on electroplating additives, chemical synthesis, and semiconductor materials application processes. This position is critical to advancing Doctech’s core technologies for 3D IC, advanced packaging, and functional materials, bridging fundamental research with industrial implementation.
Key Responsibilities
- Lead and conduct R&D on electroplating additives, including formulation design, chemical synthesis, and performance optimization
- Perform application process development and analysis for semiconductor and functional materials
- Support R&D activities related to Cu–Cu bonding, TGV (Through-Glass Via), TSV (Through-Silicon Via), and copper foil technologies, including automotive-related applications
- Design and execute experiments, analyze data, and prepare detailed technical reports and documentation
- Provide technical leadership and guidance to junior researchers and engineers
- Collaborate with cross-functional teams across R&D, engineering, and industry partners
- Actively participate in technical discussions, industry exchanges, and technology development activities
Requirements
- PhD degree in Chemical Engineering, Chemistry, Materials Science, or a related discipline
- At least 10 years of research and development experience in semiconductor materials, electroplating, or functional materials
- Strong expertise in chemical synthesis and electroplating additive development
- Proven experience spanning academia, research institutes, and/or industry environments
- Hands-on experience with application process development and materials analysis
- Experience with TGV, TSV, copper foils, or related interconnect technologies is a strong advantage
- Demonstrated ability to lead R&D projects and coordinate research teams
- Strong technical documentation, communication, and project management skills