RF & Optoelectronic IC Package Design Engineer (Automation)

A leading technology research lab in New York is seeking an IC Package Design & Automation Engineer to innovate in RF and optical packaging technologies. The role focuses on advanced EM design and automation within high-speed applications. Candidates should have a PhD in Electrical Engineering or Physics and extensive experience in package design, simulation, and analysis software. This position offers the opportunity to work on cutting-edge technology at the intersection of design and engineering.