(Senior) Lead Equipment/Process Engineer, Lithography (semiconductor 8-inch FAB)

Hong Kong Microelectronics Research and Development Institute (MRDI) is established to seize the huge potential market for third-generation semiconductors and align with the national strategy for technological development.

The vision is for the MRDI to play a leading role in strengthening collaboration with the industry, academia, and research sectors, expediting the "1 to N" transformation of scientific research outcomes, promoting technological innovation, and assisting the industry in enhancing efficiency as well as achieving upgrading and transformation.

The MRDI is looking for a dynamic and high-calibre professional to fill the position of (Senior) Lead Equipment/Process Engineer, Lithography (Semiconductor Front-end FAB).

Key Responsibilities

• Develop and optimise front-end lithography processes for semiconductor manufacturing, with hands-on experience in operating or maintaining lithography equipment (e.g., stepper, scanner, coater/developer track), particularly for CMOS‑compatible wide‑bandgap semiconductor technologies (SiC or GaN).

• Collaborate with process integration engineers and facility engineers to handle installation, commissioning, daily monitoring, and major preventive maintenance (PM) of lithography equipment to support process development for the 8-inch pilot line for third-generation semiconductors.

• Establish, optimise, and update standard operating procedures (SOPs) related to lithography processes, including exposure, alignment, coating, and development steps.

• Provide practical training on lithography processes and equipment operation to team members and trainees.

• Ensure stable operation of lithography equipment during both R&D and production phases, and maintain complete process documentation, equipment history, troubleshooting records, and updates for reference and compliance.

• Perform other duties as assigned by supervisors.

Qualifications

• A bachelor’s degree in Electronic Engineering, Mechanical Engineering, Materials Science, Physics, or related disciplines.

• At least 8 years of semiconductor fab experience with direct hands-on exposure to photolithography processes or equipment, especially in CMOS‑compatible wide‑bandgap semiconductor (SiC or GaN) process integration.

• Strong analytical skills with the ability to effectively resolve process and equipment‑related technical challenges.

• Good written and verbal communication skills in Chinese and English (including Putonghua and Cantonese), with the ability to collaborate across diverse process and facility teams.

• Able to work under pressure in a fast‑paced environment and meet tight deadlines.

Note: Candidate with less experience will be considered for junior position.

Salary will be commensurate with qualifications and experience. A gratuity of 15% of the salary will be awarded upon satisfactory completion of the contract. The incumbent will normally work five days a week. The initial employment contract spans 12 months and can be renewed with a longer tenure upon mutual agreement of the incumbent and MRDI.

APPLICATION PROCEDURE To apply, please submit the applications via JobsDB by 8 May 2026. Please specify the present/ latest salary and expected salary in the CV. Only shortlisted candidates will be notified of the result of the application. MRDI reserves the right not to fill the position.

MRDI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only.

(Information provided by applicants will be used for recruitment and other employment-related purposes.)