SR/PRINCIPAL ENGINEER, FE CPIE RAM QUALITY and OPNS ENGINEERING

Responsibilities

• Develop strategies, models, and systems to:
• Reduce wafer-at-risk and strengthen RAM defense line hardening.
• Improve RAM quality control and minimize defect variation.
• Enhance operational efficiency to achieve labor productivity, cycle time performance, and tool utilization for cost reduction.
• Establish and maintain Best Known Methods (BKM) for RAM defense and operational efficiency, ensuring sharing across all sites.
• Conduct abnormal analysis and implement corrective actions.
• Lead Copy Smart Team (CST), facilitate taskforce discussions, and drive RAM network alignment on strategy, processes, and roadmap.
• Support audits and establish metrics to monitor adoption and compliance with processes and BKMs.
• Proactively provide recommendations for program and process optimization.
• Manage projects using structured project management practices and success metrics.
• Track and benchmark Fab performance; identify gaps and improvement opportunities.
• Provide tactical support for issues related to people, safety, yield, quality, cost, and cycle time.
• Communicate strategies and updates effectively to network members and leadership.

Requirements

• Bachelor’s or Master’s degree in Engineering.
• Relevant experience in RDA and/or Metrology.
• Willingness and ability to travel internationally, including extended assignments (up to 6 months).
• Strong communication skills and ability to collaborate across functional teams.
• Ability to promote global knowledge sharing.
• Preferred skills:
• Capacity modeling, wafer risk modeling.
• FMEA, defect analysis tools, sampling strategies.
• SPC tools, cycle time management.
• Tableau, SQL, programming languages.
• Organizational change management.