Wafer Process Engineer

Responsibilities: Validate process flow and process modules. Lead and participate in startup of 300mm MEMS fab. Design and analyze DOE’s for fabrication of MEMS sensors. Coordinate process transfer of products from foundry partner to internal fab. Development, documentation, and evaluation of new process flows for inertial sensors. Investigate root cause of failures through materials analysis and process histories Statistical analysis of process and performance data, turning it into actionable information. International travel to Asia and Europe required Requirements: MS or PhD degree or equivalent in Material Science, Applied Physics, Chemistry or related field Develop process flows and work instructions for high volume manufacturing. Experience with development on 300mm equipment preferred Experience with current 200mm MEMS/Semiconductor processing Fluency in Chinese a plus Direct experience working at the module level in at least one of the following areas: Etch, Wafer Bonding, Photolithography, Wet Processing or Thin Films

Hardware Engineering