Mechanical Engineer (Electronic Warfare)

Harmattan Ai
Paris, France
On-site

Who this role is best for

A natural match if you have experience in RF electronic packaging and a background in mechanical design. This mid-level role in Paris emphasizes collaboration across hardware, software, GNC, and ML teams in the defense industry.

Best fit for

  • Candidates with hands-on experience in RF packaging and a track record of end-to-end mechanical design projects
    — “Own mechanical design from concept through prototyping and validation”
  • Professionals who have worked in defense or similar technical domains with strong attention to shielding and thermal constraints
    — “Design mechanical packaging for RF and high-power electronics”
  • Individuals with a postgraduate degree in mechanical engineering and an understanding of electrical systems
    — “MSc in Mechanical Engineering; PhD is a plus”

Things to consider

  • The role demands a mission-driven mindset and ability to handle rigorous technical challenges
    — “Rigorous, structured and mission-driven mindset with strong analytical skills”
  • Strong documentation and traceability skills are required for system reviews and technical interfaces
    — “Contribute to design and architecture reviews and maintain documentation and traceability”

How to stand out

  • Emphasize your ability to translate RF constraints into mechanical design solutions
    — “Translate RF and electronic constraints into robust mechanical designs”
  • Highlight experience in thermal management of high-power electronics in your resume
    — “Design thermal solutions for high-power, high-density electronics”
  • Showcase your cross-disciplinary collaboration experience with hardware, software, and ML teams
    — “Collaborate across HW, software, GNC and ML teams on integration and technical interfaces”
Pace · SteadyCollaboration · HighAutonomy · MediumDecision Impact · TeamLevel · Mid

Derived from job-description analysis by Serendipath's career intelligence engine.

What success looks like

  • design robust mechanical packaging
  • collaborate with cross-functional teams
Typical background
MSc in Mechanical Engineering

Skills & requirements

Required

RF Electronic PackagingThermal ManagementEmi/rf ShieldingCable Routing

Preferred

RF ExperienceHigh-power Electronics

Stack & domain

RF Electronic PackagingThermal ManagementEmi/rf ShieldingCable Routing

About the role

Original posting from Harmattan Ai via Ashby

ABOUT US

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.

Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

ABOUT THE ROLE

As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.

RESPONSIBILITIES

  • RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).
  • Thermal Management: Design thermal solutions for high-power, high-density electronics.
  • Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.
  • Mechanical Design: Own mechanical design from concept through prototyping and validation.
  • Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.
  • System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.

CANDIDATE REQUIREMENTS

  • Experience in RF electronic packaging is a must.
  • Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).
  • Strong background in mechanical design, thermal management and packaging.
  • Broad engineering culture with understanding of electrical and embedded systems.
  • MSc in Mechanical Engineering; PhD is a plus.
  • Rigorous, structured and mission-driven mindset with strong analytical skills.
  • Excellent communication and documentation abilities.

We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

Source: Harmattan Ai careers (Ashby)

Similar roles