Strong fit for experienced thermal engineers who architect liquid-cooling systems and lead cross-functional teams, with a focus on AI hardware and hybrid cooling technologies in a hybrid work arrangement based in Toronto.
Derived from job-description analysis by Serendipath's career intelligence engine.
Original posting from Tenstorrent via Greenhouse
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is building a high-performance AI platform that brings together software, compilers, platforms, networking, and semiconductors. The team values collaboration, curiosity, and solving hard problems. We are seeking a Staff Thermal Design Engineer to architect and productize advanced cooling solutions for high-performance PCIe cards and multi-chip server systems. You will lead thermal strategy for next-generation AI platforms, with a focus on complex liquid-cooling infrastructure and scalable product integration.
This role is hybrid, based out of Toronto, Canada.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are
You hold a bachelor’s or master’s degree in Thermal Engineering, Mechanical Engineering, or a related technical field, and have 10+ years of thermal design and architecture experience in enterprise servers, HPC, or specialized AI hardware.
You have hands-on experience designing and deploying server-to-rack liquid-cooling systems, with deep knowledge of CDUs, manifolds, pumps, chillers, heat exchangers, cold plates, facility water loops, and quick disconnects.
You are highly proficient in thermal simulation tools such as Ansys IcePak, FloTHERM, or SOLIDWORKS Flow Simulation, and 3D CAD tools, preferably SolidWorks.
You bring expertise in airflow management and hybrid cooling, including vapor chambers, heat pipes, fans, and advanced thermal interface materials, as well as hands-on lab validation using environmental chambers, wind tunnels, and liquid-cooling flow testers.
You are familiar with Longwin thermal testing equipment and tools such as data loggers, pressure-decay analyzers, flow meters, and airflow measurement systems; you balance thermal performance with manufacturability, cost, and reliability and can travel internationally up to 10% of the time.
What We Need
Architect and validate thermal solutions for high-power AI computing systems, including dense PCIe cards, multi-chip servers, and rack-level environments; define scalable approaches for integrating liquid cooling with air-cooled and hybrid thermal paths.
Lead CFD simulation at chip, system, and rack levels, and guide design of cooling components and interfaces, including cold plates, manifolds, TIMs, vapor chambers, heat pipes, pumps, and fans.
Define and oversee product-level validation and reliability strategies, including thermal cycling, environmental testing, leak detection, pressure-decay analysis, flow testing, and long-term thermal stability.
Lead supplier and manufacturing engagements: establish mechanical and thermal requirements, review designs and tooling, validate supplier test plans, and support critical builds, prototype testing, and manufacturing qualification on site as needed.
Drive thermal design reviews, engineering best practices, and future cooling roadmaps; mentor engineers, manage thermal component integration and lifecycle data in PLM, and produce clear architecture specifications, test reports, and design guidelines.
What You Will Learn
How to shape thermal architecture for next-generation AI platforms, from high-power PCIe cards and multi-chip servers to rack-scale systems.
How to bring advanced liquid cooling together with air and hybrid cooling technologies in products designed for performance, reliability, and scalable manufacturing.
How thermal simulations, lab validation, supplier development, and product integration work together to take complex cooling solutions from architecture through production.
How to influence future AI cooling strategies and technical standards while working across thermal, mechanical, electrical, manufacturing, and supplier teams.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.
Source: Tenstorrent careers (Greenhouse)