Unit Process Development Engineer

onsemi
Bucheon-si +2 more

Who this role is best for

A natural match if you have hands-on experience in dry etch process development for wide bandgap technologies and a track record of leading cross-functional teams.

Best fit for

  • Candidates with dry etch process experience in 8" fabs and a history of ramping technologies to 1K wafers/week
    — “Developed and successfully ramped a technology to at least 1K wafers per a week”
  • Individuals who have led cross-functional teams in semiconductor process integration and device engineering
    — “Experience in working and leading cross functional teams and remote factories”
  • Candidates with a strong background in wide bandgap technologies and process characterization
    — “Ensure for each technology node a complete set of process characterization for process monitoring and intrinsic/extrinsic reliability for power devices”

Things to consider

  • Travel is expected up to 20% of the time, which may impact work-life balance
    — “Willing to travel up to 20% of the time as required”
  • The role is based in Bucheon, Korea, with no indication of remote flexibility
    — “Bucheon, Korea as a main work site”

How to stand out

  • Highlight your experience in process qualification and production ramp for wide bandgap devices
    — “Own process development and qualification through collaboration with process integration engineers and device engineers”
  • Emphasize your ability to identify and solve process integration challenges independently
    — “They should possess analytical and proven semiconductor process integration skills to identify and solve problems”
  • Showcase your track record in improving yield and reducing defects in semiconductor manufacturing
    — “Improve yield and cost through securing wide process window and complete understanding and reduction of process defects”
  • Demonstrate your experience in tool capability improvement and CIP projects
    — “Improve tool capability through deep understanding in tool functionality and collaboration with equipment engineering team on Continuous Improvement Projects (CIP)”
Pace · SteadyCollaboration · HighAutonomy · MediumDecision Impact · Team

Derived from job-description analysis by Serendipath's career intelligence engine.

What success looks like

  • successful ramp of new technologies
  • improved yield and cost
Typical background
3+ years of experience in semiconductor engineering related field

Skills & requirements

Required

Etch Process DevelopmentWide Bandgap TechnologyProcess IntegrationUnit Process Development

Preferred

Experience With Wide Bandgap Technologies

Stack & domain

Semiconductor Process IntegrationProblem-solvingProcess CharacterizationProcess MonitoringIntrinsic/extrinsic ReliabilityProcess DefectsTool FunctionalityContinuous Improvement Projects (cip)Dry Etch Process8” Fab0.25 Um TechnologyWide Band Gap TechnologiesTechnology DevelopmentProcess Development And QualificationProcess IntegrationDevice EngineeringTool CapabilityProcess WindowCloud ServicesInfrastructureData SystemsETLData-processing PipelinesPostgreSQLClickhouseKafkaAWSGCPKubernetesInfrastructure As CodeCI/CDMonitoringAutomationAnalyticalLeadershipOwnershipDriving ImprovementCross Functional TeamsRemote FactoriesChange ManagementSemiconductorManufacturing

About the role

Original posting from onsemi

onsemi is seeking a Etch Process Development (UPD) engineer for wide bandgap technology.  This role is a critical hands-on role within the operations organization to design/optimize new SiC power technologies to be manufacturable, cost competitive and high quality.  This role will interface regularly with the Bucheon Korea manufacturing team, Power Solution Group (PSG) technology development teams, PSG new product and test engineering organizations and Corporate Quality organizations. 

The successful candidates are expected to be able to work independently as well as within teams.  They should possess analytical and proven semiconductor process integration skills to identify and solve problems, strong ownership and driving improvement across all aspects of new technology from pathfinding to production ramp.

Onsemi is seeking a Etch Process Development process engineer for wide bandgap technology ramp to drive fast ramp of new technologies without quality issue in manufacturing factories for wide band gap technologies.  These engineers will need to work with process integration engineering team, device team, package development, product engineering from fab tool selection, module unit process development, process integration flow, to enable new technologies and new products meeting customer requirement, manufacturability, high quality, and fast time to market delivery. 

These are “hands on” positions. The successful candidates are expected to be able to work independently as well as within teams.  They should possess analytical skills to identify problems, the leadership skills to own and drive improvement across all aspects of new technology from feasibility to production ramp. 

Responsibilities

Identify the gaps in global operations and be strong team members of unit process development engineers for technology development from feasibility to production ramp.

Develop capable processes that fit unified technology design rules.

Ensure for each technology node a complete set of process characterization for process monitoring and intrinsic/extrinsic reliability for power devices by collaborating with process integration and device engineering team.

Participate as operations representative for due diligence projects for wide band gap power products

Own process development and qualification through collaboration with process integration engineers and device engineers to successfully qualify and ramp wide band gap products.

Improve yield and cost through securing wide process window and complete understanding and reduction of process defects as a process owner.

Improve tool capability through deep understanding in tool functionality and collaboration with equipment engineering team on Continuous Improvement Projects (CIP).

Qualificaton

A minimum of 3years of experience in semiconductor engineering related field in Dry Etch process. An advanced degree is preferred in semiconductor processing, device physics or compatible disciplines. 

Minimum 3+ years of hands-on experience in 8” fab with at least 0.25 um technology

Experience with wide band gap technologies

Developed and successfully ramped a technology to at least 1K wafers per a week

Experience in working and leading cross functional teams and remote factories

Ability to drive changes

Willing to travel up to 20% of the time as required.

Bucheon, Korea as a main work site.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

Source: onsemi careers

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